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Hostaform® C 9021

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
General purpose injection molding grade
Chemical abbreviation according to ISO 1043-1: POM Molding compound ISO 29988- POM-K, M-GNR, 03-002 POM copolymer Standard-Injection molding type with high rigidity, hardness and toughness; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. Monomers and additives are listed in EU-Regulation (EU) 10/2011 FDA compliant according to 21 CFR 177.2470 UL-registration for all colours and a thickness more than 1.5 mm as UL 94 HB, temperature index UL 746 B electrical 110 °C, mechanical 90 °C. Burning rate ISO 3795 and FMVSS 302 < 75 mm/min for a thickness more than 1 mm. Ranges of applications: automotive engineering, precision engineering, electric and electronical industry, domestic appliances. FDA = Food and Drug Administration (USA) FMVSS = Federal Motor Vehicle Safety Standard (USA) UL = Underwriters Laboratories (USA)
General Properties

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Material Status
Commercial: Active
Documents
UL Yellow Cards

E42337 - Celanese Services Germany GmbH

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Automotive Applications
Automative Specification
BAIC Q-BJEV 01.59
Processing Method
Blow Molding
Multi-Point Data
  • Creep Modulus vs. Time (ISO 11403)
  • Creep Strain vs. Time (ISO 11403)
  • Isochronous Stress vs. Strain (ISO 11403)
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
  • Shear Modulus vs. Temperature, Dynamic (ISO 11403)
  • Shear Stress vs. Shear Rate (ISO 11403)
  • Viscosity vs. Shear Rate (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Flexural Stress, Compressive Stress, Poisson's Ratio, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (0.45 MPa) Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, Surface Resistivity, Volume Resistivity, Electric Strength, Dielectric Constant, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Flame Rating, Melt Density, Melt Specific Heat, Melt Thermal Conductivity, Ejection Temperature, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

Find specific processing information for Hostaform® POM as well as general information for the Acetal (POM) Copolymer generic family. Register or Sign In for more information.

Where To Buy

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