Hostaform® C 9021

ジェネリックファミリー： Acetal (POM) Copolymer • 提供元： Celanese Corporation

General purpose injection molding grade
Chemical abbreviation according to ISO 1043-1: POM Molding compound ISO 29988- POM-K, M-GNR, 03-002 POM copolymer Standard-Injection molding type with high rigidity, hardness and toughness; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. Monomers and additives are listed in EU-Regulation (EU) 10/2011 FDA compliant according to 21 CFR 177.2470 UL-registration for all colours and a thickness more than 1.5 mm as UL 94 HB, temperature index UL 746 B electrical 110 °C, mechanical 90 °C. Burning rate ISO 3795 and FMVSS 302 < 75 mm/min for a thickness more than 1 mm. Ranges of applications: automotive engineering, precision engineering, electric and electronical industry, domestic appliances. FDA = Food and Drug Administration (USA) FMVSS = Federal Motor Vehicle Safety Standard (USA) UL = Underwriters Laboratories (USA)

一般的な属性

Prospectorで無料のアカウントを作成し、Hostaform® C 9021のデータシート詳細すべてにアクセスします。そこで、物理、機械、硬度仕様に関するすべての情報をご覧ください

材料ステータス

Commercial: Active

ドキュメント

E42337 - Celanese Services Germany GmbH

ドキュメントのダウンロード

可用性

Africa & Middle East, Asia Pacific, Europe, Latin America, North America

用途

Automotive Applications

自動車の仕様

BAIC Q-BJEV 01.59

加工方法

Blow Molding

マルチポイントデータ

Creep Modulus vs. Time (ISO 11403)
Creep Strain vs. Time (ISO 11403)
Isochronous Stress vs. Strain (ISO 11403)
Isothermal Stress vs. Strain (ISO 11403)
Secant Modulus vs. Strain (ISO 11403)
Shear Modulus vs. Temperature, Dynamic (ISO 11403)
Shear Stress vs. Shear Rate (ISO 11403)
Viscosity vs. Shear Rate (ISO 11403)

その他の属性

Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Flexural Stress, Compressive Stress, Poisson's Ratio, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (0.45 MPa) Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Coefficient of Linear Thermal Expansion, Transverse, Surface Resistivity, Volume Resistivity, Electric Strength, Dielectric Constant, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Flame Rating, Melt Density, Melt Specific Heat, Melt Thermal Conductivity, Ejection Temperature, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure

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