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Plaskon SMT-B-1FX

Generic Family: Epoxy; EpoxideSupplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy molding compound optimized specifically for PBGA applications. It is a reduced catalyst version of SMT-B-1F and provides a 1-2% wire sweep improvement in most applications. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for PBGA applications.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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