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Plaskon SMT-B-1LAS

Generic Family: Epoxy; EpoxideSupplied by: Cookson Electronics - Semiconductor Products
This material is an epoxy molding compound optimized specifically for grid arrays (BGA/LGA) requiring low alpha particle count. It has the same unique resin system as the SMT-B-1, which minimizes warpage and enables trouble-free molding onto rigid and flexible laminate substrates. An all-spherical filler system ensures outstanding moldability both with automated and conventional molding systems. Minimal dimensional change after molding, post bake and subsequent solder treatment make this compound an excellent choice for grid array applications.
General Properties

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Material Status
Commercial: Active
Availability
North America
Processing Method
Resin Transfer Molding
Other Properties
Features, Forms, Density / Specific Gravity, Mold Shrink, Linear-Flow, Flexural Modulus, Flexural Strength, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Flame Rating, Oxygen Index, Additional Information, Injection Notes
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Processing

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Where To Buy

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