Silicone: Ultra Low Outgassing™
Product | Availability | Product Description |
---|---|---|
Ultra Low Outgassing™ SCV1-2590 | Africa & Middle East |
Ultra low outgassing™ optically clear silicone
DESCRIPTION
- Two-part, optically clear silicone system
- Low viscosity
- Convenient 1:1 mix ratio (Part A:B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
- As an embedding or potting compound for electronic assemblies and components to provide protection from extremes in humidity, radiation, thermal stress and mechanical stress
- Suitable as an adhesive in applications such as solar cell arrays where clarity and low volatility are important
- For applications requiring a low viscosity for superior flow
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV1-2596 | Africa & Middle East |
Ultra low outgassing™ electrically conductive silicone adhesive/sealant
DESCRIPTION
- Two-part, tan-colored electrically conductive silicone
- 20:1 Mix Ratio (Part A:B)
APPLICATION
- For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- Use for RFI and EMI shielding in electrical and space applications
- Well suited for form-in-place conductive gaskets
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV1-2599 | Africa & Middle East |
Ultra low outgassing™ thermally conductive silicone
DESCRIPTION
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- 15:1 Mix Ratio (Part A:B)
APPLICATION
- For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV2-2590 | Africa & Middle East |
Ultra low outgassing™ clear silicone
DESCRIPTION
- Two-part, low viscosity, clear RTV silicone
- 10:1 Mix Ratio (Part A:B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
- As an embedding or potting compound for environmental protection of electronic assemblies and components
- Provides protection from extremes in temperature, humidity, radiation, thermal stress and mechanical stress
- Low viscosity for applications requiring superior flow
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV2-2599 | Africa & Middle East |
Ultra low outgassing™, thixotropic, thermally conductive silicone
DESCRIPTION
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- Designed to allow bond line thicknesses 50 microns
- 20:1 Mix Ratio (Part A:Part B)
APPLICATION
- For applications highly sensitive to outgas related contamination
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV-2585 | Africa & Middle East |
Ultra low outgassing™ potting and encapsulating silicone elastomer
DESCRIPTION
- Two-part, translucent silicone system
- Offers a high tear strength, good physical properties and a broad operating temperature range
- Convenient 1:1 mix ratio (Part A:Part B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions
- To provide protection of electronic components and assemblies against shock, vibration, moisture, dust, chemicals and other environmental hazards
- Ideal for use in potting connectors, cable harness breakouts, molded high-voltage terminals, seals and gaskets due to its high tear strength
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV-2586 | Africa & Middle East |
Ultra low outgassing™ potting and encapsulating silicone elastomer
DESCRIPTION
- Two-part, red, low specific gravity, RTV silicone
- 1:1 Mix Ratio (Part A: Part B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables under to avoid condensation in sensitive devices
- Use a bonding, sealing, or potting material in electronic and space applications
- Provides radiation resistance, low thermal conductivity, oxidation stability, thermal stability and good ablative characteristics
- Especially useful to bond solar cells to solar array panels
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV-2590 | Africa & Middle East |
Ultra low outgassing™ clear silicone elastomer
DESCRIPTION
- Two-part, low viscosity, clear silicone system
- 10:1 Mix Ratio (Part A:B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
- As an embedding or potting compound for environmental protection of electronic assemblies and components
- Provides protection from humidity, radiation, thermal stress and mechanical stress
- As an adhesive in low-strength applications such as solar cell arrays where clarity and low volatility are important
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV-2590-2 | Africa & Middle East |
Ultra low outgassing™ black silicone
DESCRIPTION
- Two-part, low viscosity, clear silicone system
- 10:1 Mix Ratio (Part A:B)
APPLICATION
- For electronic and space applications requiring Ultra Low Outgassing™ and minimal volatile condensables to avoid condensation in sensitive devices
- As an embedding or potting compound for environmental protection of electronic assemblies and components
- Provides protection from extremes in temperature, humidity, radiation, thermal stress and mechanical stress
- As an adhesive in optical applications requiring a black material to block light
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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Ultra Low Outgassing™ SCV-2596 | Africa & Middle East |
Ultra low outgassing™ electrically conductive silicone adhesive/sealant
DESCRIPTION
- Two-part, black electrically conductive RTV silicone
- 10:1 Mix Ratio (Part A:B)
APPLICATION
- For applications requiring Ultra Low Outgassing™ and minimal volatile condensables under extreme operating conditions to avoid condensation in sensitive devices
- Use for RFI and EMI shielding in electronic and space applications
- Use to adhere covers onto housings or for any application where grooves and other configurations require a flowable to limited flow material
- For applications requiring a broader operating temperature range
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
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