Two-component encapsulating system based on polyurethane with high filler content with high thermal conductivity. The resin component is formulated with a mineral filler which provides self-extinguishing properties without use of halogen compounds. The resin does not contain halogenated flame-retardants, heavy metals or chlorofluorocarbons. The system is tested by Underwriters Labotatories under the File-No. E108835 at a thickness of 6 mm according to UL 94 V-0. The cured polymer exhibits tough-elastic properties as well as outstanding adhesion to most plastic materials, metals and glass and excellent behavior in thermal cycle tests.

Temperature range of use: -40°C to +135°C.

The casting resin is used with WEVONAT 900

Applications: Encapsulation, sealing or coating of electrical components for low and medium voltage applications like sensors, switches or PCBs.