Electrically Conductive Compounds are specifically engineered to provide anti-static, ESD and RFI/EMI shielding performance for critical electronic equipment applications. These compounds combine the performance of select engineering resins with reinforcing additives such as carbon powder, carbon fiber, nickel-coated carbon fiber and stainless steel fiber, for low to high levels of conductivity depending upon application requirements.

PA66 unreinforced general-purpose injection molding grade

Glass fiber and glass beads reinforced, flame retardant PA66 compound

Heat stabilized, glass fiber reinforced PA66 compounds

Bergamid A70 G15 H Black is a Polyamide 66 (Nylon 66) product filled with 10% glass fiber and heat stabilized. It can be processed by injection molding.

Heat stabilized

Glass fiber reinforced, flame retardant PA66 compound

13% glass fiber reinforced, PA 6.6 resin with PE for injection molding.

Glass fiber reinforced PA66 compound with impact modified

Bergamid A70 G15 H Black is a Polyamide 66 (Nylon 66) product filled with 15% glass fiber and heat stabilized. It can be processed by injection molding.

Glass fiber reinforced PA66 compound with heat stabilized.