Epoxy by Raschig GmbH
製品 | 可用性 | 製品の説明 |
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EPOXIDUR® EP 3161 E | アジア太平洋地域 |
Epoxy resin moulding composition filled with inorganic resin carriers
Increased thermal conductivity, very good electrical insulation properties and dimensional stability at high temperatures, excellent crack resistance to temperature changes/shock, very low ion content, isotropic properties
Low stress encapsulation of sensitive electronic components, especially PCBA's. Furthermore, windings (stator and rotor), magnets and primary insulation of yoke teeth in e-mobility, where improved heat dissipation is required
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3162 E | アジア太平洋地域 |
Glass-fibre and inorganic reinforced epoxy moulding compound
High thermal conductivity, good mechanical strength, very good electrical isolation properties and dimensional stability at high temperatures, excellent cracking resistance regarding thermal shock stress
Encapsulation of very sensitive electronic components where improved heat dissipation is required, in particular rotors and stators.
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3505 | アジア太平洋地域 |
Glass-fibre reinforced epoxy moulding compound
Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures
Primary application(s): Connectors, Thermocouples, Sensors, Resistors, Potentiometers
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3573 S | アジア太平洋地域 |
Mineraly reinforced epoxy resin moulding composition
User-friendly and easy to use, simple moulding and easy demoulding, short curing time, very good polishability with excellent surface quality, very low shrinkage and therefore gap-free embedding, free from bisphenols and halogenated acid anhydrides
Application: Hot mount of metallic materials for metallography resulting in a better mount with outstanding edge retention
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3580 T | アジア太平洋地域 |
Glass-fibre and inorganic reinforced epoxy moulding compound
Good mechanical strength, very good electrical isolation properties and dimensional stability even with thin wall thickness and high temperatures, very good sealing connection on metal and EPOXIDUR EP 3580 T part surfaces
Fluidproof encapsulation of electromagnetic coils, coil bodys and rectifiers
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3581 L | アジア太平洋地域 |
Glass-fibre and inorganic reinforced epoxy moulding compound
Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces, excellent crack resistance under thermal shock stress, very low ion content
Mediumproof encapsulation sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3582 | アジア太平洋地域 |
Glass-fibre reinforced and inorganically filled epoxy moulding compound
Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures
Moulding compound with a broad spectrum of applications
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3585 H | アジア太平洋地域 |
Glass-fibre reinforced and inorganically filled epoxy moulding compound
Good mechanical strength, very good electrical isolation properties and dimensional stability, excellent cracking resistance regarding thermal shock stress, outstanding heat resistance
(Automotive-)fluidproof encapsulation of sensitive electrical components
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3585 | アジア太平洋地域 |
Glass-fibre reinforced and inorganically filled epoxy moulding compound
Good mechanical strength, very good electrical isolation properties and dimensional stability even at high temperatures, excellent cracking resistance regarding thermal shock stress
Rotors, magnetic coil coatings
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3681 E | アジア太平洋地域 |
Glass-fibre and inorganic reinforced epoxy moulding compound
Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces, excellent crack resistance under thermal shock stress, very low ion content, predominantly isotropic properties
Mediumproof encapsulation of pressure- and stress-sensitive sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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EPOXIDUR® EP 3685 T | アジア太平洋地域 |
Glass-fibre and inorganic reinforced epoxy moulding compound with very low ion content
Good mechanical properties, very good electrical insulation properties and dimensional stability at high temperatures, good sealing connection on metal surfaces and EPOXIDUR EP 3685 T part surfaces, excellent crack resistance under thermal shock stress
Mediumproof encapsulation of sensors, printed circuit boards and electronic components in the automotive industry with increased demand on resistance to thermal, chemical and hydrolytic influences
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives RoHS 2, 2002/96 (WEEE) and 2006/122 (PFOS)
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RASCHIG EN 5004/5007 | アジア太平洋地域 |
Mica reinforced moulding compound
Low mould shrinkage and post-shrinkage, very good electrical values, outstanding heat resistance, very good pourability.
Primary application(s): Car lamp base H-4/H-7
This product meets the allowed upper limits for heavy metals and PCAs and also conforms to the requirements of the EU directives 2002/95 (RoHS), 2002/96 (WEEE) and 2006/122 (PFOS)
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