Epoxy by Bakelite GmbH
製品 | 可用性 | 製品の説明 |
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Bakelite® EP 8111 | アジア太平洋地域 |
Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced
Suggested uses: Encapsulation of electronics
Processes: Injection molding. Compression molding.
Benefits: Heat resistant. Improved chemical resistance. Low viscosity. Very good mechanical properties. Very high dimensional stability.
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Bakelite® EP 8410 | アジア太平洋地域 |
Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced
Suggested uses: Lamp holder
Processes: Injection molding. Compression molding.
Benefits: Heat resistant. Improved electrical properties. Low post shrinkage.
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Bakelite® EP 8412 | アジア太平洋地域 |
Type: Epoxy moulding compound, inorganically filled, glass fiber reinforced
Suggested uses: Encapsulation of electronics
Processes: Injection molding. Compression molding.
Benefits: Heat resistant. High mechanical strength. Improved chemical resistance. Low viscosity. RTI: 155 °C. UL listed. Very high dimensional stability.
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Bakelite® EP 8413 | アジア太平洋地域 |
Type: Epoxy moulding compound, mica reinforced
Suggested uses: Head lamp sockets
Processes: Injection molding. Compression molding.
Benefits: Heat resistant. Low viscosity.
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Bakelite® EP 8414 | アジア太平洋地域 |
Type: Epoxy moulding compund, inoganically filled, glass fiber reinforced
Suggested uses: Spark plug connectors. Terminal boards.
Processes: Injection molding. Compression molding.
Benefits: Heat resistant. Improved chemical resistance. Improved electrical properties.
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