LNP THERMOCOMP DF002ER compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding. Mold Release

LNP THERMOCOMP DF002ER compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding. Mold Release

LNP THERMOCOMP DF002ERH compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Easy Molding, Healthcare, Mold Release.

LNP THERMOCOMP DF002FV compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Surface Aesthetics and Wide Processing Window.

LNP THERMOCOMP DF002FVQ compound is based on Polycarbonate (PC) resin containing 10% glass fiber and available in black color only. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Good Adhesion Strength, UL94 [email protected] (black).

LNP THERMOCOMP DF002H compound is based on Polycarbonate (PC) resin containing 10% glass fiber. Added features of this grade include: Healthcare.

LNP THERMOCOMP DF003E compound is based on Polycarbonate (PC) resin containing 15% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004 compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF0041VI compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.

LNP THERMOCOMP DF0046P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF0049 compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Flame Retardant.

LNP THERMOCOMP DF0049P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing, Flame Retardant.

LNP THERMOCOMP DF004AT compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Transparent/Translucent, High stiffness/Strength

LNP THERMOCOMP DF004AXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF004ER compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DF004EXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Easy Molding.

LNP THERMOCOMP DF004P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DF004P compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DF004RXP compound is based on Polycarbonate (PC) resin containing 20% glass fiber. Added features of this grade include: Mold Release.

LNP THERMOCOMP DF004XXC compound is based on Polycarbonate (PC) resin containing 20% glass fiber.

LNP THERMOCOMP DF005 compound is based on Polycarbonate (PC) resin containing 25% glass fiber.

LNP THERMOCOMP DF006 compound is based on Polycarbonate (PC) resin containing 30% glass fiber.

LNP THERMOCOMP DF0061VI compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Improved Plating Surface and Mechanical Performance targeted for Laser Direct Structuring (LDS) applications, Non-Brominated, Non-Chlorinated Flame Retardant, Wide Processing Window.

LNP THERMOCOMP DF0069P compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Exceptional Processing. Flame Retardant.

LNP THERMOCOMP DF006AT compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Transparent/Translucent, High stiffness/Strength

LNP THERMOCOMP DF006ER compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DF006ERH is a compound based on Polycarbonate resin containing 30% Glass Fiber. Added features of this material include: Healthcare, Easy Molding, Mold Release.

LNP THERMOCOMP DF006HL compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Low Extractables, Healthcare.

LNP THERMOCOMP DF006LXN compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Low Extractables.

LNP THERMOCOMP DF006P compound is based on Polycarbonate (PC) resin containing 30% glass fiber. Added features of this grade include: Exceptional Processing.

LNP THERMOCOMP DF008 compound is based on Polycarbonate (PC) resin containing 40% glass fiber.

LNP THERMOCOMP DF0081PI compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Improved Impact, Low Warpage, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF0084 compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF008ER compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DF008ER compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Mold Release.

LNP THERMOCOMP DF008ERH compound is based on Polycarbonate (PC) resin containing 40% glass fiber. Added features of this grade include: Easy Molding, Mold Release, Healthcare.

LNP THERMOCOMP DF00A1I compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Good Ductility, Easy flow, Non-Brominated & Non-Chlorinated Flame Retardant.

LNP THERMOCOMP DF00AIP compound is based on Polycarbonate (PC) resin containing 50% glass fiber. Added features of this grade include: High Modulus, Low Warpage, Non-Brominated & Non-Chlorinated Flame Retardant.