Ablefilm 550 Datasheet

Epoxy; Epoxide

Supplied by Henkel Ablestik

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Product Description
ABLEFILM® 550™ adhesive film is designed for substrate attach and sealing microelectronic packages. This adhesive film gives off methanol, water, and ammonia during cure. Note:
Using ABLEFILM® 550™ adhesive in hermetically sealed packages is not recommended.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Features 
  • Electrically Insulating
  • Good Electrical Properties
  • Thermally Conductive
Uses 
  • Adhesives
  • Film
 
Appearance 
  • Translucent
Forms 
  • Pellets
Physical
Nominal Value
Unit
 
Water Absorption (Equilibrium, 185°F, 85%RH)
%
 
pH
 
 
Volatiles 2 (248°F)
%
 
Mechanical
Nominal Value
Unit
 
Tensile Modulus
     
-85°F
psi
 
77°F
psi
 
302°F
psi
 
482°F
psi
 
Films
Nominal Value
Unit
 
Film Thickness - Recommended / Available
 
 
Thermal
Nominal Value
Unit
 
Glass Transition Temperature
°F
 
CLTE - Flow
     
< 221°F
in/in/°F
 
> 221°F
in/in/°F
 
Thermal Conductivity (250°F)
Btu·in/hr/ft²/°F
 
Electrical
Nominal Value
Unit
 
Volume Resistivity
ohms·cm
 
Dielectric Strength (9.84E-4 in)
V/mil
 
Dielectric Constant (1 kHz)
 
 
Dissipation Factor (1 kHz)
 
 
Thermoset
Nominal Value
Unit
 
Shelf Life (-40°F)
wk
 
Post Cure Time
     
257°F
hr
 
302°F
hr
 
Additional Information
Nominal Value
Unit
 
Ionic Chloride (212°F)
ppm
 
Ionic Potassium (212°F)
ppm
 
Ionic Sodium (212°F)
ppm
 
Lap Shear 3
     
Al to Al : 77°F
psi
 
Au to Au : 77°F
psi
 
Water Extract Conductivity
µS/cm
 
Weight Loss on Heating (572°F)
%
 
Work Life (77°F)
month
 
Features
Features may also be described by the following terms: Good Electrical Properties.
Available Documents
Technical Datasheet (English)
Notes
1Typical properties: these are not to be construed as specifications.
210x10 cm sample, 20 mins
31.27 cm overlap
 
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