Ablefilm 561 Datasheet

Epoxy; Epoxide

Supplied by Henkel Ablestik

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Product Description
ABLEFILM® 561 glass supported, modified epoxy adhesive film is designed for bonding materials with severely mismatched coefficients of thermal expansion.

In many bonding applications, components bonded with ABLEFILM 561 adhesive film can be repaired.

After heating the component to 150°C, de-bonding can be accomplished by sliding a thin blade, such as a razor blade, between the bonded surfaces.

This adhesive film is also available in a low temperature cure version.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Uses 
  • Adhesives
  • Bonding
  • Film
Appearance 
  • Amber
Forms 
  • Pellets
Thermal
Nominal Value
Unit
Test Method
Glass Transition Temperature 2
°F
Internal Method
CLTE - Flow
    Internal Method
< 122°F
in/in/°F
 
> 122°F
in/in/°F
 
Thermal Conductivity 3 (250°F)
Btu·in/hr/ft²/°F
Internal Method
Electrical
Nominal Value
Unit
Test Method
Volume Resistivity 4
ohms·cm
Internal Method
Dielectric Strength 5
V/mil
Internal Method
Dielectric Constant 6 (1 kHz)
 
Internal Method
Dissipation Factor 6 (1 kHz)
 
Internal Method
Thermoset
Nominal Value
Unit
Test Method
Pot Life (73°F)
min
 
Shelf Life (-40°F)
wk
 
Demold Time
     
257°F
min
 
302°F
min
 
Post Cure Time
     
257°F
hr
 
302°F
hr
 
Additional Information
Nominal Value
Unit
Test Method
Carrier
 
 
Lap Shear
    Internal Method
Al to Al : 77°F
psi
 
Au to Au : 77°F
psi
 
Weight Loss on Heating 7 (572°F)
%
Internal Method
Work Life 8 (77°F)
month
Internal Method
Available Documents
Technical Datasheet (English)
Notes
1Typical properties: these are not to be construed as specifications.
2TMA penetration mode
3C-MATIC conductance tester
44-point probe
5AC/DC breakdown, leakage and ionization tester
6Precision digibridge
7Thermogravimetric Analyzer
825% increase in viscosity @ RT
 
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