Ablebond 84-1LMI Datasheet

Epoxy; Epoxide

Silver

Supplied by Henkel Ablestik

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Product Description
ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe.

ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Filler / Reinforcement 
  • Silver
Features 
  • Electrically Conductive
  • Low to No Outgassing
 
Uses 
  • Adhesives
Agency Ratings 
Appearance 
  • Silver
Forms 
  • Paste
Physical
Nominal Value
Unit
Test Method
pH
 
 
Viscosity - Brookfield CP51  2 (77°F)
Pa·s
 
Thermal
Nominal Value
Unit
Test Method
Glass Transition Temperature
°F
 
CLTE - Flow
     
< 217°F
in/in/°F
 
> 217°F
in/in/°F
 
Thermal Conductivity
Btu·in/hr/ft²/°F
ASTM C177
Electrical
Nominal Value
Unit
Test Method
Volume Resistivity
ohms·cm
 
Thermoset
Nominal Value
Unit
Test Method
Shelf Life
     
-40°F
wk
 
14°F
wk
 
41°F
wk
 
Post Cure Time
     
257°F
hr
 
302°F
hr
 
Additional Information
Nominal Value
Unit
Test Method
Ionic Chloride
ppm
 
Ionic Potassium
ppm
 
Ionic Sodium
ppm
 
Lap Shear - Al to Al (77°F)
psi
 
Shear Strength - Ag/Cu leadframe (Die)  3 (77°F)
N
 
Thixotropic Index 4
 
 
Water Extract Conductivity
µS/cm
 
Weight Loss on Heating (572°F)
%
 
Work Life (77°F)
day
 
Features
Features may also be described by the following terms: Electrically Conductive, Conducts Electricity, Conductive, Low Outgassing.
Agency Ratings
This plastic material has 1 certifications from the following agencies (the number in parentheses shows the number of certifications for that agency): MIL (1).
Available Documents
Technical Datasheet (English)
Notes
1Typical properties: these are not to be construed as specifications.
2Speed 5 rpm
32 X 2 mm Si die
4(0.5/5 rpm
 
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