Ablebond 789-3 Datasheet

Epoxy; Epoxide

Supplied by Henkel Ablestik

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Product Description
ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Features 
  • Bondability
  • Electrically Insulating
  • Moisture Resistant
Uses 
  • Adhesives
Appearance 
  • Amber
Forms 
  • Paste
Thermal
Nominal Value
Unit
 
Glass Transition Temperature
°F
 
CLTE - Flow
     
< 259°F
in/in/°F
 
> 259°F
in/in/°F
 
Thermal Conductivity (250°F)
Btu·in/hr/ft²/°F
 
Electrical
Nominal Value
Unit
 
Volume Resistivity
ohms·cm
 
Dielectric Strength
V/mil
 
Thermoset
Nominal Value
Unit
 
Pot Life (77°F)
min
 
Shelf Life
     
-40°F
wk
 
41°F
wk
 
Post Cure Time
     
199°F
hr
 
302°F
hr
 
Fill Analysis
Nominal Value
Unit
 
Brookfield Viscosity - CP51  2 (77°F)
Pa·s
 
Additional Information
Nominal Value
Unit
 
Lap Shear
     
Al to Al : 77°F
psi
 
Au to Au : 77°F
psi
 
Shear Strength - Die (Ceramic)  3
psi
 
Weight Loss on Heating (482°F)
%
 
Features
Features may also be described by the following terms: Moisture Resistant, Water Resistant, Low Moisture Absorption, Low Water Absorption, Bondability, Bondable.
Available Documents
Technical Datasheet (English)
Notes
1Typical properties: these are not to be construed as specifications.
2Speed 5 rpm
32 X 2 mm Si die
 
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