Ablebond 84-1LMISR4 Datasheet

Epoxy; Epoxide

Silver

Supplied by Henkel Ablestik

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Product Description
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Filler / Reinforcement 
  • Silver
Features 
  • Electrically Conductive
Uses 
  • Adhesives
  • Electrical Parts
 
Appearance 
  • Silver
Forms 
  • Pellets
Physical
Nominal Value
Unit
Test Method
Water Absorption 2 (Saturation, 185°F)
%
 
pH
 
 
Weight
     
Loss : 572°F
%
 
Loss on Cure  3
%
 
Mechanical
Nominal Value
Unit
Test Method
Tensile Modulus
     
-85°F, 0.0197 in
psi
 
77°F, 0.0197 in
psi
 
302°F, 0.0197 in
psi
 
482°F, 0.0197 in
psi
 
Thermal
Nominal Value
Unit
Test Method
Glass Transition Temperature
°F
 
CLTE - Flow
     
< 248°F
in/in/°F
 
> 248°F
in/in/°F
 
Thermal Conductivity
Btu·in/hr/ft²/°F
 
Electrical
Nominal Value
Unit
Test Method
Volume Resistivity
ohms·cm
IEC 60093
Thermoset
Nominal Value
Unit
Test Method
Pot Life (77°F)
min
 
Shelf Life (-40°F)
wk
 
Thermoset Mix Viscosity 4
cP
 
Demold Time (347°F)
min
 
Additional Information
Nominal Value
Unit
Test Method
Ionic Chloride
ppm
 
Ionic Potassium
ppm
 
Ionic Sodium
ppm
 
Thixotropic Index 5
 
 
Water Extract Conductivity
µS/cm
 
Features
Features may also be described by the following terms: Electrically Conductive, Conducts Electricity, Conductive.
Available Documents
Technical Datasheet (English)
Notes
1Typical properties: these are not to be construed as specifications.
285%RH
310 x 10 mm Si die on glass slide
4Brookfield CP51 @ 5 rpm
5Viscosity @ 0.5/Viscosity @ 5 rpm
 
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