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Ablebond 84-1LMISR4

Generic Family: Epoxy; EpoxideSupplied by: Henkel Ablestik
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
General Properties

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Material Status
供給可能
Documents
description

Technical Datasheet (English)

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Availability
北アメリカ
Uses
接着剤
Other Properties
フィラー/強化剤, 特徴, 外観, 形状, 飽和時の水分吸収, 引張弾性率, ガラス転移温度, 線膨張係数、平行, 熱伝導性, 体積抵抗率, ポットライフ, 有効期限, 熱硬化性樹脂混合粘性, 離型時間, その他の特性
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Processing

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