FARBOSET® 1115 Datasheet

Epoxy; Epoxide

Mineral

Supplied by Cosmic Plastics, Inc.

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Product Description
Cosmic FARBOSET 1115 Black is a mineral filled epoxy molding compound featuring fast cure rates, and excellent hot strength. It is designed for the encapsulation of coils, transformers, bushings, switches and other electrical and electronic components requiring good hot rigidity in molding. This material is used extensively in injection and transfer molding.
General  
Material Status 
  • Commercial: Active
Availability 
  • North America
Filler / Reinforcement 
  • Mineral
Features 
  • Fast Cure
  • High Rigidity
 
Uses 
  • Electrical/Electronic Applications
Appearance 
  • Black
Forms 
  • Granules
Processing Method 
  • Encapsulating
  • Injection Molding
  • Resin Transfer Molding
Physical
Nominal Value
Unit
Test Method
Density 2
g/cm³
 
Apparent (Bulk) Density 3
g/cm³
 
Spiral Flow
in
 
Molding Shrinkage - Flow
in/in
 
Water Absorption (24 hr, 73°F)
%
 
Mechanical
Nominal Value
Unit
Test Method
Tensile Strength
psi
 
Flexural Modulus
psi
 
Flexural Strength
psi
 
Compressive Strength
psi
 
Impact
Nominal Value
Unit
Test Method
Notched Izod Impact
ft·lb/in
 
Hardness
Nominal Value
Unit
Test Method
Durometer Hardness (Shore D)
 
 
Thermal
Nominal Value
Unit
Test Method
Deflection Temperature Under Load (264 psi, Unannealed)
°F
 
Glass Transition Temperature
°F
 
CLTE - Flow
     
-- 4
in/in/°F
 
-- 5
in/in/°F
 
Thermal Conductivity
Btu·in/hr/ft²/°F
 
Maximum Operating Temperature - Intermittent
°F
 
Electrical
Nominal Value
Unit
Test Method
Surface Resistivity
ohms
 
Volume Resistivity
ohms·cm
 
Dielectric Strength (0.125 in, Method A (Short-Time))
V/mil
 
Dielectric Constant (1 kHz)
 
 
Dissipation Factor (1 kHz)
 
 
Arc Resistance
sec
 
Flammability
Nominal Value
Unit
Test Method
Flame Rating (0.06 in)
 
UL 94
Thermoset
Nominal Value
Unit
Test Method
Shelf Life 6
     
41°F
wk
 
77°F
wk
 
95°F
wk
 
Additional Information
Nominal Value
Unit
Test Method
Loss Factor - 1 kHz
 
 
Features
Features may also be described by the following terms: Fast Cure, Fast Curing, High Rigidity.
Uses
Uses may also be described by the following terms: Electrical Applications, Electronic Applications, Electrical/Electronic Applications, Electrical Sector.
Available Documents
Technical Datasheet (English)
Uncured Properties
Nominal Value
Unit
Test Method
Curing Time
     
302°F 7
hr
 
302°F
hr
 
Injection
Nominal Value
Unit
 
Processing (Melt) Temp
°F
 
Injection Pressure
psi
 
Notes
1Typical properties: these are not to be construed as specifications.
2Molded
3Powder
4Alpha 1
5Alpha 2
6Defined as not more than 40% loss of spiral flow based on original values.
7Hot Plate Cure Time
 
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