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LOCTITE® 3329

Generic Family: Epoxy; Epoxide • Supplied by: Henkel AG & Co. KGaA
LOCTITE 3329 has been developed for encapsulation of wire bonded dies, used for Smartcard IC modules. It is designed for use only with Hysol® UV dam encapsulants, such as Hysol® 3323™. This combination of dam and fill will pass mechanical stress testing and high reliability tests; typically thermal shock cycling -55°C to +125°C and humidity heat aging 85°C / 85% RH.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Processing Method
Encapsulating
Other Properties
Filler / Reinforcement, Features, Forms, Water Absorption @ 24 hrs, Tensile Modulus, Shore Hardness, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Additional Properties, Color, Density, Viscosity, Tack Free Time
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Processing

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Where To Buy

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