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Hysol® FP6401

Generic Family: 环氧; 环氧树脂Supplied by: Henkel AG & Co. KGaA
FP6401 damming material is designed as a flow control barrier around areas of bare chip encapsulation. Its extremely low modulus makes it ideal for the protection of devices that are stress sensitive or that have tight coplanarity requirements. It should be co-cured with the encapsulant material. FP6401 exhibits high adhesion to flexible and rigid circuit substrates.

Product Benefits
  • High purity
  • Liquid flexible
  • Low viscosity
  • High thixotropy
  • Minimal slumping
  • Low modulus
General Properties

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Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

Download Document
Availability
亚太地区, 北美洲, 拉丁美洲, 欧洲, 非洲和中东
Uses
Encapsulant
Processing Method
包封
Other Properties
填料/增强材料, 特性, 外观, 拉伸模量, 抗张强度, 断裂伸长率, 玻璃转化温度, 线性热膨胀系数,流动, 密度, 粘度, 固化时间, 储存稳定性, 贮藏期限
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Processing

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Where To Buy

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