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Hysol® GR869

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
GR869 is a green semiconductor grade molding compound especially designed for SOIC, TSOP and QFP packages with Ni/Pd and copper leadframes. It offers much improved JEDEC performance as well as moldability property.

GR869 meets UL 94 V-0 Flammability at 3.175mm thickness.

Product Benefits
  • Green product
  • Low stress
  • High adhesion
  • Low moisture absorption
  • Excellent solder reflow resistance
  • High moldability
General Properties

Access the complete datasheet details for Hysol® GR869 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Other Properties
Filler / Reinforcement, Features, Appearance, Density / Specific Gravity, Spiral Flow, Flexural Modulus, Flexural Strength, Shore Hardness, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Thermal Conductivity, Flame Rating, Additional Properties, Gel Time, Shelf Life
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Processing

Find specific processing information for Hysol® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

You can purchase Hysol® GR869 from 1 distributors or manufacturers. Register or Sign In for more information.

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