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Hysol® KL-2500-1K™

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
Hysol® KL-2500-1K™ is a low thermal expansion and low stress molding compound suitable for GBU, KBU, TO, ZIP, SIP, DIP and SDIP packages, providing superior moldability and reliability.

Applications
  • Semiconductor Molding Compounds
  • Through-Hole Discretes
General Properties

Access the complete datasheet details for Hysol® KL-2500-1K™ when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Other Properties
Filler / Reinforcement, Features, Spiral Flow, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Thermal Conductivity
Access 6 properties in Plastics. Create your free account or sign into Prospector.
Processing

Find specific processing information for Hysol® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

You can purchase Hysol® KL-2500-1K™ from 1 distributors or manufacturers. Register or Sign In for more information.

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