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STYCAST® 50500D

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
STYCAST 50500D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.

Product Benefits
  • Low modulus of elasticity
  • Low stress
  • High purity
  • Non-sag
  • Low warpage
General Properties

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Material Status
供給可能
Documents
description

Technical Datasheet (English)

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Availability
アジア太平洋地域, アフリカ&中東, ラテンアメリカ, 北アメリカ, 欧州
Uses
Encapsulant
Processing Method
封入
Other Properties
フィラー/強化剤, 特徴, 外観, 吸水率(24時間), 引張弾性率, デュロメーター硬度, ガラス転移温度, 線膨張係数、平行, 熱伝導性, 誘電率, 誘電正接, その他の特性, Solids Content, 密度, 動粘性率, 硬化時間, 有効期限, Lap Shear Strength
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Processing

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Where To Buy

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