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LOCTITE® 3118™

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
LOCTITE® 3118™ cures rapidly at relatively low temperature and provides excellent adhesion on a wide range of substrates. Typical applications include Memory cards, CCD/CMOS Assemblies.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Bonding
Other Properties
Features, Appearance, Forms, Density, Mold Shrink, Linear-Flow, Water Absorption 24h/23C, Tensile Modulus, Tensile Stress at Break, Tensile Strain at Break, Shore Hardness, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Surface Resistivity, Volume Resistivity, Dielectric Constant, Dissipation Factor, Additional Properties, Density, Viscosity, Curing Time, Pot Life, Lap Shear Strength
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Processing

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Where To Buy

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