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Hysol® CB0260-1

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
CB0260-1 features excellent flow properties allowing it to penetrate fine pitch wires and deep cavities without entrapping voids. This product can withstand solder reflow after being exposed to JEDEC level 2 (85°C/60% RH, 168 hours) preconditioning. A cavity or potting dam is required for flow control.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Processing Method
Encapsulating
Other Properties
Filler / Reinforcement, Features, Appearance, Flexural Modulus, Flexural Strength, Shore Hardness, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Volume Resistivity, Dielectric Constant, Dissipation Factor, Additional Properties, Density, Viscosity, Curing Time, Gel Time, Pot Life, Shelf Life
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Processing

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Where To Buy

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