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Hysol® EO7039

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
EO7039 encapsulant is designed for attachment of integrated circuits and components to advanced flexible substrates. This material is formulated to produce a void-free bond line with excellent interfacial adhesive strength to a wide variety of organic substrates and various metal surfaces.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Processing Method
Encapsulating
Other Properties
Features, Appearance, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Additional Properties, Viscosity, Curing Time, Pot Life, Shelf Life
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Processing

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Where To Buy

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