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Hysol® FP4450HF

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
FP4450HF encapsulant is designed for protection of bare semiconductor devices. Autoclave performance on live devices is greater than 1,000 hours with no failure, depending upon device and package type. The use of synthetic fused silica yields alpha particle emissions suitable for memory devices. A cavity or potting dam is required for flow control.
General Properties

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Material Status
Comercial: Ativo
Documents
description

Technical Datasheet (English)

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Availability
África & Oriente Médio, América do Norte, América Latina, Ásia/Pacífico, Europa
Uses
Aplicações Elétricas/Eletrônicas
Processing Method
Encapsulamento
Other Properties
Carga/Reforço, Características, Aparência, Temperatura de transição vítrea, Coeficiente de expansão térmica linear, Fluxo, Propriedades adicionais, Densidade, Viscosidade, Gel Time, Pot Life, Shelf Life
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Processing

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Where To Buy

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