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Hysol® KL-G800H CD

Generic Family: Epoxy; EpoxideSupplied by: Henkel AG & Co. KGaA
KL-G800H CD epoxy molding compound is suitable for thin leaded package. This material is designed to achieve JEDEC Level 2 requirements, at 260°C reflow temperature.
General Properties

Access the complete datasheet details for Hysol® KL-G800H CD when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Electrical/Electronic Applications
Other Properties
Filler / Reinforcement, Features, Appearance, Density / Specific Gravity, Spiral Flow, Mold Shrink, Linear-Flow, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Flame Rating, Gel Time, Shelf Life
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Processing

Find specific processing information for Hysol® as well as general information for the Epoxy; Epoxide generic family. Register or Sign In for more information.

Where To Buy

You can purchase Hysol® KL-G800H CD from 1 distributors or manufacturers. Register or Sign In for more information.

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