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Hysol® US1151™

Generic Family: Urethane, RTVSupplied by: Henkel AG & Co. KGaA
HYSOL® US1151™ is a low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. Introduction of this material on a bed of 8-12 mesh sand increases thermal conductivity while decreasing shrinkage and cost. HYSOL® US1151™ can be used to encapsulate electronics for various applications including under-the-hood automotive and marine. The low glass transition temperature means that sensitive compounds are not damaged during low temperature excursions.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Uses
Automotive Under the Hood
Processing Method
Encapsulating
Other Properties
Features, Appearance, Mold Shrink, Linear-Flow, Water Absorption @ 24 hrs, Durometer Hardness, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Surface Resistivity, Volume Resistivity, Dielectric Strength, Dielectric Constant, Dissipation Factor, Additional Properties, Color, Mix Ratio by Weight (PBW), Mix Ratio by Volume (PBV), Density, Viscosity, Curing Time, Pot Life
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Processing

Find specific processing information for Hysol® as well as general information for the Urethane, RTV generic family. Register or Sign In for more information.

Where To Buy

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