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Miramid® DK2010CW

Generic Family: Polyamide 6Supplied by: BASF Leuna GmbH
General Properties

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Material Status
Comercial: Activo
Documents
description

Processing - Injection Molding (English)

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description

Technical Datasheet (English)

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Availability
Europa
Uses
Elementos de automoción bajo el capó
Processing Method
Moldeo por Inyección
Other Properties
Carga/refuerzo, Aditivo, Características, Formas, Densidad, Absorción de agua, Absorción de humedad, Número de viscosidad, Módulo de tensión, Esfuerzo a la rotura, Deformación a la rotura, Resistencia al impacto Charpy con entalle (+23°C), Resistencia al impacto Charpy con entalle (-30°C), Resistencia al impacto Charpy (+23°C), Resistencia al impacto Charpy (-30°C), Temp. de deflexión bajo carga (0,45 MPa), Temp. de deflexión bajo carga (1,80 MPa), Temperatura de fusión (calorimetría de barrido diferencial, DSC), Resisitividad específica de volumen, Constante dieléctrica, Factor de disipación (1 MHz), Índice comparativo de formación de surcos eléctricos, Temp. de procesamiento (fusión), Temperatura del molde
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Processing

Find specific processing information for Miramid® Polyamide as well as general information for the Polyamide 6 generic family. Register or Sign In for more information.

Where To Buy

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