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Miramid® SE30C

Generic Family: Polyamide 66Supplied by: BASF Leuna GmbH
General Properties

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Material Status
Commercial: Active
Documents
description

Processing - Injection Molding (English)

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description

Technical Datasheet (English)

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Availability
Europe
Uses
Automotive Applications
Automative Specification
FMVSS 302
Processing Method
Injection Molding
Multi-Point Data
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
Other Properties
Filler / Reinforcement, Additive, Features, Forms, Density, Water absorption, Humidity absorption, Viscosity number, Tensile modulus, Stress at break, Strain at break, Flexural Stress, Charpy notched impact strength (+23°C), Charpy notched impact strength (-30°C), Charpy impact strength (+23°C), Charpy impact strength (-30°C), Temp. of deflection under load (0.45 MPa), Temp. of deflection under load (1.80 MPa), Melting Temperature (DSC), Volume resistivity, Dielectric Constant, Dissipation factor (1 MHz), Comparative tracking index, Processing (Melt) Temp, Mold Temperature
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Processing

Find specific processing information for Miramid® Polyamide as well as general information for the Polyamide 66 generic family. Register or Sign In for more information.

Where To Buy

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