D/W 200 is skived from a modified homopolymer PTFE resin containing a higher level of a fully fluorinated comonomer than is in our 220 film. The incorporation of the comonomer yields a material with improved electrical and physical properties. This film can be thermally bonded (fused) to itself (625 - 650 degrees F). The modified homopolymer resin exhibits chemical resistance equivalent to that of homopolymer PTFE. Its tensile strength is approximately 25% higher, and the elongation is approximately 60% higher than for homopolymer PTFE. Because of these properties D/W 200 is often a good substitute for melt Processable films such as PFA.

D/W 200 may be thermally fused to itself making possible the fabrication of structures requiring these properties. D/W 200 can also be used as a high dielectric strength fusible wrap in electrical and electronic cable applications. It can also be used as a bonding film in the circuit board industry.