Fusion TM 706 is a low-durometer, high-purity fluoroelastomer, developed for a wide range of semiconductor processing sealing applications. Special engineering applications requiring low sealing force materials, such as bonded slit valve gates, are well suited for Fusion TM 706.

Recommended for use in a range of plasma equipment applications, from etch and plasma enhanced CVD to plasma ashing applications, Fusion TM 706 is ideal for sealing devices that must accommodate tolerance stack-up conditions.

Fusion TM 706 offers very low-metallic ion levels and good resistance to today’s advanced process chemistries. Contact Greene Tweed’s Semiconductor engineering and sales experts for specific application recommendations.