LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3162 Hardener. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.

LOCTITE® PE 3140 Epoxy Resin is a low viscosity, resin that is designed to be mixed with LOCTITE® PE 3165 Hardener. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures (200°F for 2-4 hours).

LOCTITE® PE 3141 Epoxy Resin is a resin formulated to offer improved long term performance at higher temperatures when mixed with LOCTITE® PE 3160 Epoxy Hardener. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and bond strength to most thermoplastics.

LOCTITE® PE 3141 Epoxy Resin is a resin formulated to offer improved long term performance at higher temperatures when mixed with LOCTITE® PE 3165 Epoxy Hardener. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures.

LOCTITE® PE 3142 forms a potting compound with high thermal conductivity when mixed with LOCTITE® PE 3160. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and good bond strength to most thermoplastics.

LOCTITE® PE 3142 Epoxy Resin forms a potting compound with high thermal conductivity when mixed with LOCTITE® PE 3162. This mixture forms a fast gelling, low viscosity, room temperature cure potting compound.

LOCTITE® PE 3142 Epoxy Resin forms a potting compound resin with high thermal conductivity when mixed with LOCTITE® PE 3165. This mixture forms a resilient, low exotherm, room temperature gel material that develops high Tg after exposure to elevated temperatures.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that is formulated to offer improved flame retardance when mixed with LOCTITE® PE 3162 Epoxy Hardener. This mixture is a low viscosity, room temperature cure product which features fast gelling during cure.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that offers improved flame retardance when mixed with LOCTITE® PE 3163. This mixture forms a resilient, long work time, no blush potting compound with good surface finish and good bond strength to most thermoplastics.

LOCTITE® PE 3144 Epoxy Resin is a potting compound resin that offers improved flame retardance when mixed with LOCTITE® PE 3164. This mixture forms a resilient, low viscosity, fast gelling, room temperature cure, with easy mix 2:1 ratio.

LOCTITE STYCAST 2651MM CAT 23LV is a general purpose encapsulant designed for machine dispensing and for parts requiring post molding machining. LOCTITE STYCAST 2651MM CAT 23LV can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - General purpose - Low viscosity - Low color - Good machinability - Excellent adhesion to glass - Thermal shock and impact resistant - Reduced abrasion in meter/mix equipment

LOCTITE STYCAST EO 7038 is a one component epoxy potting system, formulated to protect sensors used in harsh environments, such as automotive applications.

STYCAST 2017M4 is an epoxy encapsulant developed for blue Light Emitting Diodes.

STYCAST 2850KT CATALYST 24LV epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern. STYCAST 2850KT can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations.

STYCAST 2850KT CATALYST 9 epoxy encapsulant is designed for heat sink replacement in non-integrated electrical components and assemblies. it is also recommended for use in high voltage applications where surface arcing or tracking is a concern. STYCAST 2850KT can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - Two component - Low CTE - High thermal conductivity - Thermally conductive - Electrically insulative - General purpose - Good chemical resistance - Good physical strength

STYCAST 3050 Catalyst 9 is designed for potting and encapsulation applications with very small physical spacing between parts. The filler system is non-abrasive and readily machinable. This is a consideration when using a dispensing equipment or where subsequent machining of the cured part is required. STYCAST 3050 can be used with a variety of catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. Product Benefits - Very low viscosity - Excellent penetration into tightly packed assemblies - Good machinability - General purpose - Room temperature cure - Good chemical resistance - Good physical strength

STYCAST 50500-1 fill encapsulant is designed to be used with STYCAST 50300 HT dam encapsulant in glob top applications. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required.

STYCAST 50500D is designed to be used as a dam encapsulant in combination with a "fill" encapsulant in glob top applications for protecting wire bonded bare IC's. This combination of materials is also suited for the protection of multiple chips and for encapsulating components where a well defined glob height and flat surface are required. Product Benefits - Low modulus of elasticity - Low stress - High purity - Non-sag - Low warpage

One Component, Fast Curing, Low Viscosity Underfill Encapsulant STYCAST A 312 is a one component, unfilled, solventless epoxy underfill encapsulant. STYCAST A 312 is a fast curing product with excellent chemical, heat and moisture resistance combined with good dielectric properties. Application STYCAST A 312 can be used as capillary flow underfill on CSP & BGA devices. STYCAST A 312 improves the attachment strength of CSP & BGA devices during mechanical stress testing such as drop and bend testing.

STYCAST A 312-20 is a one component heat cured, slightly thixotropic 100% solids, liquid epoxy adhesive and insulation compound. STYCAST A 312-20 will cure as low as 100°C. Applications: STYCAST A 312-20 is a Class B (130°C) product, has excellent chemical, heat, and moisture resistance and has good dielectric properties.

STYCAST NX-17 is a one-component thermosetting clear encapsulant developed for SMD-type LEDs. The product features a low viscosity that enables easy handling, and strong adhesion to case and lead frame that realizes highly reliable LEDs with excellent heat shock performance. Applications: STYCAST NX-17 can be used as clear encapsulant for many types of SMD LEDs. The product is particularly suitable for top-view type that requires high reliability, such as those for automotive applications.