Epoxid (Epoxid): EPO-TEK®
Produkt | Verfügbarkeit | Produktbeschreibung |
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EPO-TEK® T905-1 | Afrika und Mittlerer Osten |
Two component, thermally conductive, electrically insulating epoxy suggested for general adhesive bonding, sealing, potting and encapsulation applications. Replacement for EPO-TEK® T905.
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EPO-TEK® T905BN-3 | Afrika und Mittlerer Osten |
EPO-TEK® T905BN-3 is a thermally conductive, electrically insulating epoxy designed for heat sinking and encapsulation.
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EPO-TEK® T905BN-4 | Afrika und Mittlerer Osten |
EPO-TEK® T905BN-4 is a two component, room temperature cure, thermally conductive epoxy for general adhesive bonding, sealing, potting and encapsulation applications
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EPO-TEK® TD1001 | Afrika und Mittlerer Osten |
EPO-TEK® TD1001 is a single component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging.
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EPO-TEK® TD1001-67 | Afrika und Mittlerer Osten |
EPO-TEK® TD1001-67 is a soft single component, thermally conductive, electrically insulating epoxy. It is a more compliant version of EPO-TEK® TD1001.
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EPO-TEK® TJ1104-LH | Afrika und Mittlerer Osten |
EPO-TEK® TJ1104-LH is a black, single component, low halogen, electrically insulating die attach adhesive with extended pot life.
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EPO-TEK® TJ2183-LH | Afrika und Mittlerer Osten |
A two component, low-halogen, electrically insulating die attach adhesive with extended pot life.
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EPO-TEK® TV2001 | Afrika und Mittlerer Osten |
EPO-TEK® TV2001 is a two component, thermally conductive, electrically insulating epoxy designed for low stress semiconductor and electronics packaging. Low Tg, moderate pot-life, snap-curing and very low modulus are a few of its traits. It is particularly suitable for bonding ferrite cores in power device plastic packaging. Excellent adhesion to PCBs, ceramics, most metals and lead-frames. Also available in a frozen syringe.
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EPO-TEK® TZ101 | Afrika und Mittlerer Osten |
EPO-TEK® TZ101 is a single component, electrically insulating, thermally conductive epoxy adhesive designed for heat-sinking of semiconductors, hybrids, electronics, and optics. Also available in a frozen syringe.
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EPO-TEK® U300-2 | Afrika und Mittlerer Osten |
A two component epoxy designed for capillary underfill of semiconductor chips and SMDs. Long pot-life, high Tg, and optical clarity are a few of its traits. NASA approved low outgassing epoxy (http://outgassing.nasa.gov) suitable for electronic applications such as smart cards, RFIDs, medical implants and wafer level camera optics.
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EPO-TEK® UD1355 | Afrika und Mittlerer Osten |
Optically clear UV curable adhesive and encapsulant designed to resist discoloration during solder reflow processing.
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EPO-TEK® UJ1190 | Afrika und Mittlerer Osten |
EPO-TEK® UJ1190 is a clear, UV curable adhesive.
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