ABLEBOND® 789-3™ die attach adhesive is designed for microelectronic applications. This adhesive exhibits strong adhesion to difficult-to-bond metals and retains its bond strength after exposure to moisture.

ABLEBOND® 84-1LMI die attach adhesive is designed for microelectronic chip bonding. This adhesive is ideal for application by automatic dispenser or hand probe. ABLEBOND® 84-1LMI meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 84-1LMINB1 die attach adhesive is formulated to bond difficult-to-wet surfaces such as palladium-silver capacitors terminations. This adhesive reduces capacitor shorting problems caused by resin bleed. ABLEBOND® 84-1LMINB1 meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.

ABLEBOND® 84-1LMIT1 adhesive is designed for die attach applications. It is designed for screen printing using 325 mesh. ABLEBOND® 84-1LMIT1 meets the requirements of MIL-STD-883C, Method 5011.

ABLEBOND® 84-3 adhesive is designed for die attach applications. This adhesive is ideal for application by automatic dispensing, screen printing or hand.

ABLEBOND® 85-1® adhesive is designed for hybrid applications where silver migration is a critical concern. ABLEBOND® 85-1® meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 958-11 adhesive is designed to absorb stresses produced when bonding large ICs. ABLEBOND® 958-11 meets the requirements of MIL-STD-883, Method 5011.

ABLEBOND® 965-1L electrically conductive, stress-absorbing die attach adhesive is designed for bonding large die integrated circuits to substrates with mismatched coefficients of thermal expansion. ABLEBOND 965-1L adhesive exhibits very low levels of contaminants. The rheology of this adhesive is tailored for high speed,automated assembly operations. This product cures to yield a void-free bondline with minimal resin bleed.

ABLEBOND® 967-1™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe.

ABLEBOND® 967-3™ adhesive is designed for applications which require lower-than-normal cure temperatures. It is ideal for application by automatic dispenser, screen printing, or hand probe. This material is a electrically insulating version of ABLEBOND 967-1 adhesive.