10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the formulation. 10-3003 yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high performance epoxy adhesive exhibits outstanding physical, thermal, and electrical insulation properties. 10-3004 NC is available as a very low viscosity version of 10-3003. 10-3002 is available as a higher viscosity version of 10-3003. Features: - Non-critical mix ratio - Ability to adjust flexibility of bond line - Outstanding thermal shock resistance - Excellent chemical resistance - Very good operating temperature range

10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the formulation. 10-3003 yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high performance epoxy adhesive exhibits outstanding physical, thermal, and electrical insulation properties. 10-3004 NC is available as a very low viscosity version of 10-3003. 10-3002 is available as a higher viscosity version of 10-3003. Features: - Non-critical mix ratio - Ability to adjust flexibility of bond line - Outstanding thermal shock resistance - Excellent chemical resistance - Very good operating temperature range

10-3003 is a new high bond strength epoxy adhesive formulated for ease in handling and convenience for the end user. This system has a non-critical mix ratio and adjustable flexibility. 10-3003 is also very safe to use due to the absence of harmful solvents and toxic chemicals in the formulation. 10-3003 yields high peel strength and excellent tensile strength. It also has outstanding thermal shock, impact and vibration resistance. This high performance epoxy adhesive exhibits outstanding physical, thermal, and electrical insulation properties. 10-3004 NC is available as a very low viscosity version of 10-3003. 10-3002 is available as a higher viscosity version of 10-3003. Features: - Non-critical mix ratio - Ability to adjust flexibility of bond line - Outstanding thermal shock resistance - Excellent chemical resistance - Very good operating temperature range

5 MINUTE SET NON-SAG EPOXY These high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - Non-sag consistency - High bond strength - Fast room temperature cure - three speeds to choose from - Water & chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

5 minute set epoxy These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - High bond strength - Fast room temperature cure - three speeds to choose from - Water and chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

10-3008 is a filled, high performance structural epoxy adhesive. 10-3008 is a flexible adhesive with outstanding lap shear and peel strength. It is a great choice for bonding substrates of differing coefficients of thermal expansion. 10-3008 is also an excellent adhesive for applications requiring impact and vibration resistance. 10-3008 has a convenient 1:1 by volume mix ratio and therefore is ideal for Dual Barrel Cartridge packaging. 10-3008 is stocked in 50ML and 200ML Dual Cartridge sizes. 10-3008 contains non-abrasive fillers and therefore is well suited for meter mix and dispense equipment. Features: - 1:1 Non-critical mix ratio - High lap shear strength - Thermal shock resistance - Excellent chemical resistance

10-3012 is a high strength, fast setting epoxy adhesive. This epoxy adhesive and potting compound is specially formulated for high clarity, good impact strength and water resistance. Applications: - This outstanding adhesive is ideally suited for a wide range of jewelry, industrial, structural and electrical applications. This adhesive is an excellent choice for field repairs. Features: - High bond strength - Water and chemical resistant - Good impact strength - Convenient 1:1 mix ratio - Room temperature cure - Fills gaps and voids - Fast setting

20 MINUTE SET NON-SAG EPOXY These high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - Non-sag consistency - High bond strength - Fast room temperature cure - three speeds to choose from - Water & chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

20 minute set epoxy These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - High bond strength - Fast room temperature cure - three speeds to choose from - Water and chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

10-3033 is a room temperature curing, two component epoxy. The 10-3033 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Features: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

10-3041 is a toughened industrial grade epoxy adhesive. Once mixed, the adhesive forms structural bonds quickly and is tack free within thirty minutes. A 3,000 psi lap shear strength (aluminum to aluminum) is achieved within four hours. 10-3041 provides a unique combination of high lap shear strength, high peel resistance and impact endurance. Once fully cured, the epoxy adhesive is also resistant to a wide range of chemicals and solvents. The adhesive also offers higher heat performance than most fast setting epoxies. The medium viscosity of the 10-3041 allows for easy application. It is packaged in the easy to use TriggerBond® dispensing system. 10-3041 is low in odor and cures under a wide range of temperatures and humidity levels. The high performance epoxy adhesive forms excellent bonds to a wide variety of plastics and metals. It acts as an outstanding electrical insulator and therefore suitable for many electronic bonding applications. Features: - Fast room temperature cure - Low odor (no mercaptan functionality) - Packaged in TriggerBond system - Forms strong bonds to a variety of substrates - Electrically insulating - Vibration and impact resistant

10-3044 is a two component epoxy adhesive and sealant. This structural adhesive has excellent chemical and heat resistance. 10-3044 is widely used as a stencil and screen adhesive due to its bonding strength and toughness. It has been used extensively to bond polyester mesh to aluminum frames and for the bonding of stainless steel foil to polyester mesh. Benefits: - Bonds to a variety of substrates - Resistant to severe chemical environments - High operating temperature - Fast Curing - Resistant to shock, vibration and flexing

46 MINUTE SET NON-SAG EPOXY These high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - Non-sag consistency - High bond strength - Fast room temperature cure - three speeds to choose from - Water & chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

46 minute set epoxy These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals, pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers, etc... These adhesives were tested in our laboratory for flame retardancy properties. According to our test results they meet the requirements of UL94HB. Applications: - These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging. Features: - High bond strength - Fast room temperature cure - three speeds to choose from - Water and chemical resistance - Outstanding thermal shock resistance - 1:1 mix ratio - Impact resistance

10-3050 is a thixotropic, Non-Sag, gel epoxy designed to protect motor windings from abrasives, chemicals, vibration, oils, jet fuels, etc... 10-3050 self levels to a smooth void free coating once applied with a spatula or brush. 10-3050 stays exactly where applied and will not run out of coil windings or stator slots. This unique adhesive forms a tenacious bond to most substrates. 10-3050 is color coded to facilitate proper mixing of Resin and Catalyst. 10-3050 Resin is White and Catalyst is Black.

10-3062 is a room temperature curing, two component, epoxy potting compound and adhesive. The 10-3062 provides good water resistance, adhesion, and toughness. It is packaged in the convenient TriggerBond® dual barrel cartridge system. The 10-3062 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in "indirect" food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Benefits: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

10-3063 is a room temperature curing, two component, epoxy potting compound and adhesive. The 10-3063 provides good water resistance, adhesion, and toughness. It is packaged in the convenient TriggerBond dual barrel cartridge system. The 10-3063 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Benefits: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals and woods, most plastics and rubbers and masonry products. This system is designed for electronic, aerospace and other demanding industrial applications. This product is available in the popular TriggerBond® dual barrel cartridge system. 10-3216 is also available in a translucent unfilled version: 10-3216 TR. Features: - Impact resistant - Excellent electrical insulator - High peel and shear - Outstanding structural bonds - Convenient 1:1 Ratio - Retention of strength after environmental aging

10-3216 is a toughened, flexible, and impact resistant epoxy adhesive. 10-3216 is a two component system that forms strong structural bonds at room temperature. This unique adhesive system provides high peel and shear strengths. 10-3216 is excellent for bonding many metals and woods, most plastics and rubbers and masonry products. This system is designed for electronic, aerospace and other demanding industrial applications. This product is available in the popular TriggerBond® dual barrel cartridge system. 10-3216 is also available in a translucent unfilled version: 10-3216 TR. Features: - Impact resistant - Excellent electrical insulator - High peel and shear - Outstanding structural bonds - Convenient 1:1 Ratio - Retention of strength after environmental aging

10-3713 is used as a two component ultra clear epoxy adhesive designed for a variety of bonding applications. 10-3713 forms a crystal clear bond line and is formulated with proprietary ultraviolet protectors to minimize yellowing of the cured epoxy. This adhesive when UV aged in a QUV Weatherometer outperforms other commercially available adhesives. Any excess adhesive or visible bond lines are less noticeable due to the adhesives outstanding clarity. 10-3713 is low in viscosity and therefore offers maximum wetting and penetration of substrates. Tenacious bonds are formed at room temperature or with mild heat. 10-3713 should be used anywhere a clear, strong bond is required. Features: - Gap filling - UV protected - Water clear - Outstanding adhesion - Low viscosity - Bonds to most substrates

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. - Very low viscosity These unique adhesives exhibit outstanding bond strengths to a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc... They are currently used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications and anywhere a tough indestructible bond is required.

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. - Medium viscosity These unique adhesives exhibit outstanding bond strengths to a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc... They are currently used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications and anywhere a tough indestructible bond is required.

These one component heat cure epoxy adhesives are fast setting materials formulated in three different viscosities. They are known for their low temperature cure, heat and excellent chemical resistance. - Paste non-sag These unique adhesives exhibit outstanding bond strengths to a variety of substrates including metals, ceramics, wood, magnets, plastics, glass, etc... They are currently used in a variety of electronic bonding and potting applications, filer end cap assemblies, magnetic bonding applications and anywhere a tough indestructible bond is required.

20-3001 NC is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its convenient 1:1 mix ratio and lack of fillers make it an ideal material for meter mix and dispense equipment. 20-3001 NC has been formulated for ease in handling. Its low viscosity aids in filling voids and air pockets. In addition, there is no filler settling with this system. 20-3001 NC is the non-crystallizing version of the original 20-3001 product.

20-3001 is a low viscosity, unfilled epoxy potting and encapsulating system which forms a bubble free glass like finish when cured. This is a 100% solids resin system that does not contain any solvents. Its convenient 1:1 mix ratio and lack of fillers make it an ideal material for meter mix and dispense equipment. 20-3001 has been formulated for ease in handling. Its low viscosity aids in filling voids and air pockets. In addition, there is no filler settling with this system.

20-3002 is a two component epoxy adhesive /sealant designed for small area potting. It is low in viscosity, unfilled and does not contain solvents.

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. 20-3004 LV is a low viscosity self leveling system. 20-3004 HV is a high viscosity non-sag version. Features: - Excellent chemical resistance - Excellent water resistance - Excellent adhesion to metals & plastics - DOT noncorrosive

20-3004 LV & HV are two component chemical resistance epoxy systems. They were developed for potting, coating, and adhesive applications requiring superior chemical resistance. They exhibit outstanding bonds to a variety of substrates. 20-3004 LV is a low viscosity self leveling system. 20-3004 HV is a high viscosity non-sag version. Features: - Excellent chemical resistance - Excellent water resistance - Excellent adhesion to metals & plastics - DOT noncorrosive

20-3006 is a unique two component, electronic grade, flexible epoxy potting compound. This system was engineered to provide electrical insulation, chemical protection, and thermal shock resistance. The flexibility of 20-3006 provides low stress on surface mount and other delicate electronic components. This encapsulating and potting compound has an easy one to one mix ratio, and is D.O.T. non-hazardous. Features: - Flexibility provides low stress on components - Chemical resistance - Excellent electrical insulation - Convenient one to one mix ratio - D.O.T. Non-Hazardous

20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features: - Low Dielectric Constant - Low Coefficient of Thermal Expansion - Low Shrinkage - Low Density - Excellent Moisture Resistance

20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features: - Low Dielectric Constant - Low Coefficient of Thermal Expansion - Low Shrinkage - Low Density - Excellent Moisture Resistance

20-3035 is a low density, two component epoxy potting and encapsulating system. The 20-3035 is less than half the weight of most commercially available potting compounds. 20-3035 exhibits very low shrinkage during the cure cycle and also has a low coefficient of thermal expansion. This unique epoxy system is an ideal material for the potting of electronic assemblies where a low dielectric constant and low weight are required. This epoxy syntactic foam system utilizes an advanced micro balloon technology filler. The 20-3035 provides high strength and stiffness, thermal and environmental stability, creep resistance, and water resistance. Features: - Low Dielectric Constant - Low Coefficient of Thermal Expansion - Low Shrinkage - Low Density - Excellent Moisture Resistance

20-3060 is a general purpose, low viscosity epoxy potting and encapsulating resin system. This is a 100% solids system. It therefore does not contain any solvents. 20-3060 is a filled system resulting in excellent dimensional stability and extremely low shrinkage. 20-3060 is characterized by exceptional resistance to impact, vibration, and hermal shock. In addition, this versatile resin system is machinable and ideal for use with meter mix dispensing equipment. Due to its high purity, 20-3060 offers the ultimate in physical, thermal and electrical insulation properties. The cured polymer exhibits excellent resistance to chemicals, moisture, solvents and environmental exposure. 20-3060 is recommended for applications requiring the optimum in over-all properties and where rigid or flexible wire leads protrude directly from the encapsulant. This system eliminates microscopic cracking when leads are flexed. It also adheres extremely well to lead materials, such as vinyl, neoprene, natural rubber, etc... 20-3060 has found wide acceptance as an encapsulant for applications such as transformers, coils, chokes, solenoids, resistors, modules, microcircuitry, resistors, capacitors, etc... 20-3060 has been formulated for ease in handling and its low viscosity aids in pouring, filling voids and air pockets. In addition, the fillers in 20-3060 have been dispersed to minimize any heavy settling.

20-3064 NC is a filled Epoxy Resin System engineered to give the end user the ability to control the hardness of the cured casting. By varying the mix ratio the hardness can be varied from 60 Shore A to 85 Shore D. 20-3064 NC provides excellent thermal shock resistance and outstanding adhesion. 20-3064 NC LV is a low viscosity version of 20-3064 NC.

20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness. The 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in "indirect" food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Features: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

20-3068 is a room temperature curing, two component, epoxy potting compound and adhesive. This product provides good water resistance, adhesion, and toughness. The 20-3068 Epoxy System meets the Food and Drug Administration (FDA) regulations permitting use in "indirect" food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Features: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness. The 20-3072 and 20-3072LV Epoxy Systems meet the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Benefits: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

20-3072 is a room temperature curing, two component, epoxy potting compound and adhesive. Both the 20-3072 and 20-3072LV (low viscosity version of 20-3072) provide good water resistance, adhesion, and toughness. The 20-3072 and 20-3072LV Epoxy Systems meet the Food and Drug Administration (FDA) regulations permitting use in “indirect” food contact applications. The raw materials used in the products comply with the FDA regulations of Title 21 Code of Federal Regulations under Sections 175.105 and 175.300. Benefits: - Excellent adhesion - Excellent chemical and corrosion resistance - Excellent electrical insulation

20-3213 is a one component insulating epoxy. It is low in viscosity (3,000cps) and suitable for electronic applications requiring high dielectric properties. This system does not contain volatile organic compounds (VOC’s) and is designed for encapsulating, coating, and impregnating applications. It can also be used as an underfill encapsulant or electronic insulating adhesive.

20-3236 Resin is a low viscosity copolymer adhesive and potting compound specifically designed for bonding vinyls and neoprenes. 20-3236 Resin has an extended working time and a convenient 2:1 mix ratio. 20-3236 Resin can be used in many difficult bonding applications. It is also used for the encapsulation of vinyl insulated electrical components or sealing vinyl lead wires. FEATURES: - Bonds to vinyls and neoprenes - Long working time - Low viscosity - High peel strength