Prospector

Polykarbonat (PC): TRINSEO CELEX™

Produkt Verfügbarkeit Produktbeschreibung
TRINSEO CELEX™ 310HF.M Asien Pazifik
Trinseo CELEX™ 310HF.M glass fiber reinforced polycarbonate resin is a 10% glass fiber reinforced polycarbonate material. It provides a property balance of easy flow, superior ignition resistance, high rigidity, dimension stability and heat resistance. It provides the injection molded part with good aesthetics. It does not contain Chlorine/or Bromine and phosphate type flame retardants. It is designed for a wide range of applications, e.g. computer enclosures, electronic accessories and electrical appliances.
TRINSEO CELEX™ 3600-10 Asien Pazifik
CELEX™ 3600 enthält einen nicht chlorierten, nicht bromierten und nicht phosphathaltigen Flammhemmer und ist für den Einsatz bei Spritzgießanwendungen in den Branchen Computer, Elektronik, Elektrogeräte und IT-Geräte geeignet.
TRINSEO CELEX™ 3600-20 Asien Pazifik
CELEX™ 3600-20 enthält einen nicht chlorierten, nicht bromierten und nicht phosphathaltigen Flammhemmer und ist für den Einsatz bei Spritzgießanwendungen in den Branchen Computer, Elektronik, Elektrogeräte und IT-Geräte geeignet.
TRINSEO CELEX™ 3700-10 Asien Pazifik
Trinseo CELEX™ 3700-10 is an ignition resistant polycarbonate (PC) resin that contains no chlorinated or brominated or phosphorous based flame retardants and provides superior ignition resistance. This resin combines good mechanical and high heat properties and maintains excellent processability. It is an easy flow PC resin suitable for use in injection molded applications in the computer, electronics, electrical and information technology equipment markets.
TRINSEO CELEX™ 3700-15 Asien Pazifik
Trinseo CELEX™ 3700-15 is an ignition resistant polycarbonate (PC) resin that contains no chlorinated or brominated or phosphorous based flame retardants and provides superior ignition resistance. This resin combines good mechanical and high heat properties and maintains excellent processability. It is an easy flow PC resin suitable for use in injection molded applications in the computer, electronics, electrical and information technology equipment markets.
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