LNP THERMOCOMP 6C004XXAR1 compound is based on Polycarbonate / Polybutylene Terephthalate (PC/PBT) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Improved Chemical Resistance, Lower Warp and Good Surface Finish.

LNP THERMOCOMP DC0041XA51 compound is based on PC Copolymer Resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Smooth Surface Finish. This halogen-free flame retardant resin is EN45545 R1 HL3 and R7 HL2 compliant and an ideal candidate for train interior applications (category R1). It also meets requirements of NFPA-130a

LNP THERMOCOMP AM DC004XXA11is a compound based on High Heat PC resin containing 20% carbon fiber for Large Format Additive manufacturing (LFAM) applications, including mid-temperature autoclaving tooling. This compound can offer higher temperature performance than standard PC and avoid some of the processing challenges associated with high temperature materials.

LNP THERMOCOMP DC004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% carbon fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Stiffness vs. glass fiber, Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.

LNP THERMOCOMP DF004XXAR1 compound is based on Polycarbonate (PC) resin containing 20% glass fiber for Large Format Additive Manufacturing (LFAM) applications. Added features of this grade include: Higher Strength, Higher Temperature Performance and Higher Throughput compared to ABS and PPE, as well as Excellent Ductility and Smooth Surface Finish.