CONAP CE-1170 is a single-component air drying room temperature curing acrylic conformal coating that meets the requirements of MIL-I-46058-C for Type AR coatings. CONAP CE-1170 is a solvent-based coating designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability, as well as to provide the u ltimate in humidity resistance and hydrolytic stability while retaining excellent flexibility to prevent fracturing of fragile components during thermal cycling. Its electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy-glass laminates even in adverse environmental conditions. Components may be removed by heating the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultraviolet light.

CONAP CE-1171 is a single-component acrylic conformal coating that has been formulated in Rule 66 exempt solvents and meets the latest requirements of MIL-I-46058C for Type AR coatings. CONAP CE-1171 is designed for thin-film applications on components and printed circuitry. It was developed specifically for its fast drying time and reparability and to provide the ultimate in humidity resistance and hydrolytic stability. CONAP CE-1171 retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Electrical properties are outstanding. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Components may be removed by melting through the coating with a soldering iron, or the entire coating may be removed with a suitable solvent. A tracer dye has been incorporated to aid inspection under ultra-violet light.

CONAP CE-2290 is a single-component acrylic conformal coating that is formulated with non-petroleum-based, bio-derived solvents. The product is on the qualified products list (QPL) for MIL-I-46058C and is approved to the IPC-CC-830B for Type AR coatings. The solvent portion of CONAP CE-2290 is an EPA-approved SNAP composition containing no ozone depleting chemicals. It is non-carcinogenic, contains no HAPs and is non- SARA reportable. CONAP CE-2290 is designed for thin-film applications on components and printed circuitry. It provides fast drying times, reparability, outstanding humidity resistance and hydrolytic stability. CONAP CE-2290 has outstanding electrical properties and retains excellent flexibility to prevent fracturing of fragile components during thermal cycling. Cured films maintain excellent adhesion to phenolic and epoxy glass laminates even in adverse environmental conditions. Component removal is possible by melting through the coating with a soldering iron. Removal of the entire coating is possible with a suitable solvent. CONAP CE-2290 incorporates a tracer dye to aid inspection under ultraviolet light.