Commercial: Active

Africa & Middle East, Asia Pacific, Europe, Latin America, North America

Filler / Reinforcement, Also Available In, Density / Specific Gravity, Density, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Mold Shrink, Linear-Flow, Mold Shrink, Linear-Trans, Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption 24h/23C, Water Absorption @ Sat., Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Modulus, Tensile Strength, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Strength, Flexural Stress, Flexural Strength at Yield, Flexural Strength at Break, Compressive Strength, Coefficient of Friction, Taber Abrasion Resistance, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Reverse Notch Izod Impact, Instrumented Dart Impact, Rockwell Hardness, Rockwell Hardness, Ball Indentation Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Vicat Softening Temperature, CLTE, Flow, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, CLTE, Transverse (TMA), Coefficient of Linear Thermal Expansion, Transverse, Thermal Conductivity, Thermal Conductivity, RTI Elec, RTI Imp, RTI Str, Surface Resistivity, Surface Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Relative Permittivity, Dissipation Factor, Dissipation Factor, Comparative Tracking Index, Glow Wire Ignition Temperature, Oxygen Index, Oxygen Index, Drying Temperature, Drying Time, Suggested Max Moisture, Suggested Shot Size, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Back Pressure, Screw Speed, Vent Depth, Injection Notes