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EPO-TEK® H20E

Generic Family: Epoxy; EpoxideSupplied by: Epoxy Technology Inc.
EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. It has proven itself to be extremely reliable over many years of service and is still the conductive adhesive of choice for new applications. Also available in a single component frozen syringe.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, North America
Uses
Adhesives
Other Properties
Filler / Reinforcement, Features, Agency Ratings, RoHS Compliance, Forms, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Thermoset Components, Additional Properties, Color, Density, Viscosity, Curing Time, Shore Hardness, Volume Resistivity
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Processing

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Where To Buy

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