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EPO-TEK® H70S

Generic Family: Epoxy; EpoxideSupplied by: Epoxy Technology Inc.
EPO TEK® H70S is a modified version of EPO TEK ® H70E, designed primarily for die stamping. It is a highly reliable, alumina- filled epoxy with a smooth, flowable consistency, designed for chip bonding in micro-electronic and opto-electronic applications.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, North America
Uses
Adhesives
Other Properties
Features, Agency Ratings, RoHS Compliance, Forms, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Thermoset Components, Additional Properties, Color, Density, Viscosity, Curing Time, Shore Hardness, Volume Resistivity, Dielectric Constant, Dissipation Factor
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Processing

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Where To Buy

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