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Ablebond 84-1LMISR4

Generic Family: 环氧; 环氧树脂Supplied by: Henkel Ablestik
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
General Properties

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Material Status
已商用:当前有效
Documents
description

Technical Datasheet (English)

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Availability
北美洲
Uses
电气元件
Other Properties
填料/增强材料, 特性, 外观, 形式, 饱和时吸水率, 拉伸模量, 玻璃转化温度, 线性热膨胀系数,流动, 导热系数, 体积电阻率, 储存稳定性, 贮藏期限, 热固性混合粘度, 脱模时间, 其他性能
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Processing

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