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Ablebond 84-1LMISR4

Generic Family: Epoxy; Epoxide • Supplied by: Henkel Ablestik
ABLEBOND® 84-1LMISR4 electrically conductive die attach adhesive has been formulated for use in high throughput, automatic die attach equipment. The rheology of ABLEBOND 84-1LMISR4 adhesive allows minimum adhesive dispense and die put down dwell times, without tailing or stringing problems. The unique combination of adhesive properties makes this material one the most widely used die attach materials in the semiconductor industry.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
North America
Uses
Adhesives
Other Properties
Filler / Reinforcement, Features, Appearance, Forms, Water Absorption @ Sat., Tensile Modulus, Glass Transition Temperature, Coefficient of Linear Thermal Expansion, Flow, Thermal Conductivity, Volume Resistivity, Pot Life, Shelf Life, Thermoset Mix Viscosity, Demold Time, Additional Properties
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Processing

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Where To Buy

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