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Hostaform® C 13031 XAP

Generic Family: Acetal (POM) Copolymer • Supplied by: Celanese Corporation
high stiffness
Polyacetal copolymer, reduced emission Easy flowing Injection molding type like C 13021 XAP®, but with higher strength, rigidity and hardness over the entire permissible temperature range for HOSTAFORM®; good chemical resistance to solvents, fuel and strong alkalis as well as good hydrolysis resistance; high resistance to thermal and oxidative degradation. Emissions according to VDA 275 < 10 ppm (natural and colored grades). Burning rate ISO 3795 and FMVSS 302 < 100 mm/min for a thickness more than 1 mm. Ranges of applications: For molded parts with higher requirements to strength, rigidity und hardness, ranges of applications with fuel contact.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet

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Availability
Africa & Middle East, Asia Pacific, Europe, Latin America, North America
Processing Method
Injection Molding
Multi-Point Data
  • Creep Modulus vs. Time (ISO 11403)
  • Isochronous Stress vs. Strain (ISO 11403)
  • Isothermal Stress vs. Strain (ISO 11403)
  • Secant Modulus vs. Strain (ISO 11403)
  • Shear Stress vs. Shear Rate (ISO 11403)
  • Viscosity vs. Shear Rate (ISO 11403)
Other Properties
Additive, Features, Forms, Density, Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption Sat/23C, Water Absorption 23C/50RH, Tensile Modulus, Tensile Stress at Yield, Tensile Strain at Yield, Nominal Tensile Strain at Break, Tensile Creep Modulus 1h, Tensile Creep Modulus 1000h, Flexural Modulus, Charpy Notched Impact Strength, Charpy Unnotched Impact Strength, Ball Indentation Hardness, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Melting Temperature, Coefficient of Linear Thermal Expansion, Flow, Surface Resistivity, Volume Resistivity, Electric Strength, Relative Permittivity, Dissipation Factor, Comparative Tracking Index (CTI), Melt Thermal Conductivity, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Hopper Temperature, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Injection Rate, Back Pressure
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Processing

Find specific processing information for Hostaform® POM as well as general information for the Acetal (POM) Copolymer generic family. Register or Sign In for more information.

Where To Buy

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