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LEXAN™ Healthcare Resin HP1R - Americas

Generic Family: PolycarbonateSupplied by: SABIC
LEXAN™ HP1R resin is a 25 MFR polycarbonate, MVR of 23. Mold release. Biocompatible (ISO10993 or USP Class VI) grade for medical devices and pharmaceutical applications. It is EtO and steam sterilizable. Subject to SABIC healthcare management of change process.
General Properties

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Material Status
Commercial: Active
Documents
UL Yellow Cards

E121562 - SABIC INNOVATIVE PLASTICS US L L C

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Availability
Latin America, North America
Uses
Appliances
Other Properties
Also Available In, Density / Specific Gravity, Melt Mass-Flow Rate (MFR), Melt Volume-Flow Rate (MVR), Molding Shrinkage, Water Absorption @ 24 hrs, Water Absorption @ Sat., Water Absorption @ Equil, Tensile Modulus, Tensile Modulus, Tensile Strength at Yield, Tensile Stress at Yield, Tensile Strength at Break, Tensile Stress at Break, Tensile Elongation at Yield, Tensile Strain at Yield, Tensile Elongation at Break, Tensile Strain at Break, Flexural Modulus, Flexural Modulus, Flexural Stress, Flexural Strength at Yield, Taber Abrasion Resistance, Charpy Notched Impact Strength, Notched Izod Impact, Notched Izod Impact Strength, Unnotched Izod Impact, Unnotched Izod Impact Strength, Instrumented Dart Impact, Gardner Impact, Tensile Impact Strength, Rockwell Hardness, DTUL (66 psi) - Unannealed, DTUL (0.45 MPa) Unannealed, DTUL (264 psi) - Unannealed, DTUL (1.80 MPa) Unannealed, Vicat Softening Temperature, Ball Pressure Test, CLTE, Flow (TMA), Coefficient of Linear Thermal Expansion, Flow, Specific Heat, Thermal Conductivity, Thermal Conductivity, RTI Elec, RTI Imp, RTI Str, Surface Resistivity, Volume Resistivity, Volume Resistivity, Dielectric Strength, Electric Strength, Dielectric Constant, Relative Permittivity, Dissipation Factor, Dissipation Factor, Comparative Tracking Index (CTI), High Amp Arc Ignition (HAI), High Voltage Arc Resistance to Ignition (HVAR), Hot-wire Ignition (HWI), Flame Rating, Oxygen Index, Refractive Index, Light Transmittance, Haze, Additional Properties, Drying Temperature, Drying Time, Suggested Max Moisture, Suggested Shot Size, Rear Temperature, Middle Temperature, Front Temperature, Nozzle Temperature, Processing (Melt) Temp, Mold Temperature, Back Pressure, Screw Speed, Vent Depth, Injection Notes
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Processing

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Where To Buy

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