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DENISTAT Z 30C 03

Generic Family: 聚二甲苯酰胺Supplied by: Vamp Tech
PPA resin, 30% carbon fiber reinforced, semiconductive for injection moulding
General Properties

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Material Status
已商用:当前有效
Availability
亚太地区, 北美洲, 拉丁美洲, 欧洲, 非洲和中东
Processing Method
注射成型
Other Properties
填料/增强材料, 特性, 密度, 拉伸模量, 拉伸断裂应力, 拉伸断裂应变, 悬壁梁缺口冲击强度, 无缺口伊佐德冲击强度, DTUL (264 psi) - 未退火, 连续使用温度, 维卡软化温度, 表面电阻率, 干燥温度, 干燥时间, 加工(熔体)温度, 模具温度
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Processing

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