Ultra Low Outgassing™ SCV2-2599
DESCRIPTION
- Two-part, white, thermally conductive silicone
- Cures with the addition of heat
- Designed to allow bond line thicknesses 50 microns
- 20:1 Mix Ratio (Part A:Part B)
APPLICATION
- For applications highly sensitive to outgas related contamination
- To provide heat transfer between electrical/electronic components and their heat sinks
- Use to adhere integrated circuit substrates, base plates, heat sinks or where grooves or other configurations require a non-flowable to limited flow material
Exceeds the ASTM E 595 low outgas specifications outlined in NASA SP-R-0022A and European Space Agency PSS-014-702, with a TML of =0.1% and CVCM of =0.010%
General Properties
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Technical Datasheet (English)
Download DocumentProcessing
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Where To Buy
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