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EPO-TEK® 430

Generic Family: Epoxy; EpoxideSupplied by: Epoxy Technology Inc.
A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for inter-connecting, grounding and EMI RF shielding. Fast curing at relatively low temperatures may be realized.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, North America
Uses
Adhesives
Other Properties
Filler / Reinforcement, Features, Agency Ratings, RoHS Compliance, Forms, Glass Transition Temperature, CLTE, Flow, Thermal Conductivity, Thermoset Components, Additional Properties, Color, Density, Viscosity, Curing Time, Shore Hardness, Volume Resistivity
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Processing

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Where To Buy

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