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EPO-TEK® H20E-HC

Generic Family: Epoxy; EpoxideSupplied by: Epoxy Technology Inc.
EPO-TEK® H20E-HC is a two component, 100% solids silver-filled epoxy system designed specifically for chip bonding in microelectronic and optoelectronic applications. It is also used extensively for thermal management applications due to its high thermal conductivity. Also available in a single component frozen syringe. This is an increased thermal conductivity version of EPO-TEK H20E.
General Properties

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Material Status
Commercial: Active
Documents
description

Technical Datasheet (English)

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Availability
Africa & Middle East, Asia Pacific, Europe, North America
Uses
Adhesives
Other Properties
Filler / Reinforcement, Features, Agency Ratings, RoHS Compliance, Forms, CLTE, Flow, Thermal Conductivity, Thermoset Components, Additional Properties, Color, Density, Viscosity, Curing Time, Shore Hardness, Volume Resistivity
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Processing

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Where To Buy

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