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KYOCERA KE-G1200

Generic Family: Epoxy; EpoxideSupplied by: KYOCERA Chemical Corporation
Special Epoxy Molding Compounds Optimizing Warpage and Applicable to Fine Pitch Wire for BGA Package

Strong Points
  • Less Warpage in All Types of Area Array Packages due to High Tg Characteristic.
  • Applicable to Fine Pitch Wire Bonding with Good Wire Sweep Performance.
  • Achieve High Yield after Molding due to Excellent Moldability that allows its application to MAP.

Application
  • Standard P-BGA, HS-BGA and LGA Package.
  • Multi Chip Module (Stacked or Side by Side Layout)
  • IC Card, Memory Card etc.

Low Alpha Ray Type: KE-G2200
General Properties

Access the complete datasheet details for KYOCERA KE-G1200 when you create your free account with Prospector. You’ll find complete information on physical, mechanical and hardness specs.

Material Status
供給可能
Documents
description

Technical Datasheet (English)

Download Document
Availability
アジア太平洋地域
Uses
電気/電子機器
Other Properties
特徴, 密度 / 比重, スパイラルフロー, 溶液粘度, 曲げ弾性率, 曲げ強度, ガラス転移温度, 線膨張係数、平行
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Processing

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Where To Buy

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